Dicing process
Use of a dicing device equipped with a rotating blade.
To accurately cut and chip the circuits formed on Si wafers, a technique called dicing is used. The mainstream method involves using a dicing machine equipped with a rotating blade. At Toyowa Industry Co., Ltd., we handle processing not only for Si wafers but also for glass, ceramics, single crystal materials, resins, and more. The cutting water can be compatible with pure water. We accommodate everything from prototype processing to mass production. Additionally, we can provide cutting methods tailored to your applications (such as scribing). For more details, please contact us or refer to our catalog.
- Company：豊和産業
- Price：Other
